Προσοχή!

Για να σας εξασφαλίσουμε μια κορυφαία εμπειρία, στο site μας χρησιμοποιούμε cookies.

Αν συνεχίσετε, υποθέτουμε ότι συμφωνείτε να λαμβάνετε cookies από αυτόν τον ιστότοπο.

ΕΝΤΑΞΕΙ

Περισσότερες Πληροφορίες

Μόνο για εμπόρους και επαγγελματίες

Team Group T-FORCE VULCAN FLBD532G6000HC38ADC01 memory module 32 GB 2 x 16 GB DDR5 6000 MHz (FLBD532G6000HC38ADC01)

MUB729192
1 (EXPRESS) - 10 (STANDARD) εργάσιμες ημέρες
Δε-Πα (09:00-17:00) 2104401212
Επεξήγηση διαθεσιμοτήτων
Περιγραφή

Sleek Design
For the T-FORCE VULCAN DDR5, TEAMGROUP has adopted a gorgeous streamlines design with multi-angular to overall outline for visual aesthetics and showcase VULCAN DDR5's unique features, delivering a sleek OC gaming memory that packs a powerful performance.

Reinforced Structure
The VULCAN DDR5 is molded from a single block of aluminum alloy through stamping and the top structure is fixed with a snap fastener.

Better Cooling
TEAMGROUP uses a professional-grade thermal conducting silicon to reinforce adhesion between the cooling fin and memory. The silicon also allows for incredible cooling as it transfers the heat from top to bottom rapidly, ensuring that the memory remains at the optimal operating temperature.

Supports Intel XMP3.0 for One-Click Overclocking
Supports the latest Intel XMP3.0 and one-click overclocking technology; users can experience ultra-fast overclocking speeds at a single click.

Strengthened PMIC Cooling Design
The VULCAN DDR5 is equipped with professional thermal conductive silicon, make PMIC cooling design for more effective, and stable PMIC operations.

Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
The VULCAN DDR5 memory is equipped with PMIC, minimizing noise interference ensuring stable, efficient power distribution across all components for rapid, and reliable power supply.

On-die ECC for Stable System
The VULCAN DDR5 memory supports on-die ECC, which offers error correction and detection to ensure that system stability is not compromised for performance.

High-Quality ICs Selected for Stability & Reliability
TEAMGROUP has selected a high-quality IC die that has undergone comprehensive compatibility and reliability testing to ensure an OC gaming memory that delivers both stability and compatibility.
Χαρακτηριστικά

Κατασκευαστής:
Team Group
Cooling type:
  • Heatsink
On-Die ECC:
  • Yes
Lens system
Component for:
  • PC
Memory
Buffered memory type:
  • Unregistered (unbuffered)
CAS latency:
  • 38
ECC:
  • No
Intel Extreme Memory Profile (XMP):
  • Yes
Intel Extreme Memory Profile (XMP) version:
  • 3.0
Internal memory type:
  • DDR5
Memory clock speed:
  • 6000 MHz
Memory form factor:
  • 288-pin DIMM
Memory layout (modules x size):
  • 2 x 16 GB
Memory voltage:
  • 1.25 V
Packaging data
Package type:
  • Box
Storage
Internal memory:
  • 32 GB
Weight & dimensions
Depth:
  • 140 mm
Height:
  • 32.7 mm
Width:
  • 7.5 mm
Πιθανότατα σας ενδιαφέρουν
  • Νέα Προϊόντα
  • Δημοφιλή Προϊόντα